Crucial T710 1000GB

Specifications

Core

Capacity 1000 GB

Form Factor M.2 2280

Interface PCIe 5.0 x4

Performance

Seq Read 14900 MB/s

Seq Write 13700 MB/s

Endurance (TBW) 600 TBW

Price History

Price history excludes Amazon sources

SSD Description

The Crucial T710 uses the Phison PS5026-E26 client controller paired with Micron 232-layer 3D TLC NAND and a dedicated LPDDR4 DRAM cache to drive PCIe 5.0 performance. The NAND operates at an accelerated 2400 MT/s transfer rate to achieve the specified sequential throughput, while the DRAM cache manages mapping tables for consistent sustained write performance and reduced write amplification. Thermal management is critical: the drive is known to engage thermal throttling aggressively if core temperatures exceed 81°C. Sequential speeds are significantly higher than Gen4 predecessors, but low-queue-depth random 4K performance is still largely constrained by NAND latency. The architecture is optimized for Microsoft DirectStorage, enabling GPU-decompression of assets in supported applications.

Key Specifications

  • Interface: PCIe 5.0 x4 (NVMe 2.0)
  • Sequential Read/Write: 14,900 MB/s / 13,700 MB/s
  • Controller: Phison PS5026-E26 (12nm process)
  • NAND Flash: Micron 232-Layer 3D TLC (B58R)
  • NAND Transfer Rate: 2400 MT/s
  • DRAM Cache: Yes (LPDDR4)
  • Encryption: TCG Opal 2.01 supported
  • PCB Layout: Double-sided
  • Thermal throttling threshold: ~81°C

Hardware Alternatives

  • Crucial T705: The direct predecessor sharing nearly identical NAND binning and firmware logic.
  • MSI Spatium M580 Frozr: Uses the same controller/NAND combination with a focus on extreme passive cooling solutions.
  • Corsair MP700 PRO SE: A direct hardware clone utilizing the same 2400 MT/s NAND interface for maximum sequential throughput.
  • TeamGroup T-Force Z540: Competes in the same PCIe 5.0 tier, trading blows in sustained write scenarios depending on firmware revision.
  • Samsung 990 PRO: While limited to PCIe 4.0 speeds, competes in random I/O latency and power efficiency and generally manages thermals more effectively.

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